Device manufacturing examples
Leave the design and manufacturing of vacuum devices to us!
Here is an introduction to a case study of equipment manufacturing that our company has undertaken.
- Company：コスモ・サイエンス
- Price：Other
Sputtering Equipment Product List and Ranking from 50 Manufacturers, Suppliers and Companies | IPROS GMS
Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
Sputtering Equipment Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
Sputtering Equipment Product ranking
Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.
- Sputtering device ジャパンクリエイト
- HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
- Barrel/drum-type powder sputtering device ジャパンクリエイト
- Magnetron sputtering device for high-precision optical filter film deposition ティー・ケイ・エス
- 4 Remote plasma ion beam sputtering device ティー・ケイ・エス
Sputtering Equipment Product List
1～30 item / All 136 items
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Multi-purpose sputtering device
Support from research and development to mass production!
Supported by highly reliable standard hardware and a wealth of experience, Shinko Seiki has been active in many fields since launching its first machine in 1967. We provide state-of-the-art equipment that consistently leads the way with flexible and advanced software.
- Company：神港精機 東京支店
- Price：Other
Standard Batch Type Sputtering Device (SRV Series)
Multi-functional, compact, flexible support, a standard lineup with proven results and trust.
A standard batch-type sputtering series that incorporates a three-element cathode into a compact housing. It covers the film deposition process for various electronic devices and related materials from basic development to mass production, thanks to a wide uniform range of film thickness distribution and an automatic control mechanism. Our film deposition processes and options, supported by numerous delivery records, will reliably meet your requirements.
- Company：神港精機 東京支店
- Price：Other
Research and development sputtering equipment
Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.
Realization of the capabilities of a higher-end model capable of small-scale production using a manually operated simple experimental machine. An 8-inch compatible multi-frequency RF sputtering device. Supports fundamental research in MEMS, compound semiconductors, and electronic devices due to high-speed exhaust and excellent process performance. A series of batch-type sputtering devices with a proven track record in mass production of electronic components.
- Company：神港精機 東京支店
- Price：Other
SDR-type roll-to-roll sputtering device (RtoR type sputtering device)
Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.
Achieving mass production of flexible electronic devices represented by FPC with proven results. Reliable response to various individual requirements through process support using in-house demonstration equipment. Proven results with a wide range of substrates, including not only general resin films but also metal foils. Stable operation is realized through a high-utilization cathode developed in-house and a well-established transport mechanism. Equipped with a variety of optional mechanisms such as plasma pre-treatment electrodes, cathodes for magnetic materials, and main rolls for substrate heating, it can be operated as a multipurpose continuous film processing device. Flexible realization of hardware and software according to purpose and application, including small machines for R&D and batch-type equipment compatible with sheets.
- Company：神港精機 東京支店
- Price：Other
Mass production compatible batch-type sputtering system (Model STH10311)
A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.
This is a batch-type sputtering device that achieves both processing capacity for mass production and excellent film thickness uniformity by adopting multiple self-rotation substrate stages. Despite being a chamber system exceeding 1 meter due to the side sputtering method, it enables easy attachment and detachment of substrates and targets, as well as simplified maintenance within the vacuum chamber. It incorporates essential considerations for mass production equipment, such as a data logging system optimal for mass production and control interface software that facilitates device control and management. It balances quality and throughput for large substrates represented by 300 mm wafers, as well as for the mass production of small electronic components like resistors and sensors.
- Company：神港精機 東京支店
- Price：Other
Demonstration of the load lock type sputtering device (single wafer transport type) is currently in progress.
From discrete components to advanced devices, from R&D to mass production. A compact, high-quality, multi-purpose CtoC type sputtering system.
A load-lock type sputtering device based on single-sheet substrate transport, sharing the process chamber and transport mechanism with a higher-end model (multi-chamber type). Capable of meeting high-level film quality requirements for mass production and prototyping of various ICs (discrete ICs, custom ICs, compounds). Proven track record in the development of next-generation devices (ferroelectric film development, oriented nitride film formation) in both software and hardware. Achievements include AlN films for UV-LED templates, oxide films for sensors, highly uniform electrode films, thin-film heaters, ferroelectric (PZT) films, and many others.
- Company：神港精機 東京支店
- Price：Other
Multi-chamber sputtering device
A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.
Actively responding to various applications and substrates that are difficult to accommodate with standard specifications. Dedicated mechanisms are prepared for many substrates, including R&D, discrete components, compounds, MEMS, packaging, assembly processes, masks, and small FPDs. Tray transport of substrates is also standard, enabling film deposition and processing of different types of substrates on the same device through atmospheric substrate handling. In addition to application-specific cathodes (wide erosion, ferromagnetic materials, oxides, reactive types), we support a wide range of applications with special substrate mechanisms (high-temperature heating, magnetic field application, cooling, etc.). Dedicated devices are individually designed based on process tests using in-house demonstration machines.
- Company：神港精機 東京支店
- Price：Other
Hard film sputtering device STL5521 type (for precision lens molds)
Multi-layer film deposition using a maximum of 5 yuan cathodes. Wear resistance, heat resistance, and smooth thin films. High throughput even for high-temperature deposition with a load lock type.
Ideal for forming high heat-resistant wear-resistant films necessary for the coating of precision lens molds. Precious metal alloys such as Pt and Ru suitable for lens mold coatings are efficiently formed using a multi-target simultaneous sputtering method with a small-diameter cathode. Additionally, films with excellent heat resistance and hardness can also be formed using a nano-multilayer structure. A special substrate holder that can rapidly heat substrates like precision lens molds, along with a dedicated load-lock mechanism, achieves improved throughput.
- Company：神港精機 東京支店
- Price：Other
Atmospheric non-exposure multi-sputtering device
Sulfur compound compatibility available. Dedicated film deposition device for research on thin-film solid-state batteries. Comprehensive support from target to film deposition testing, including dedicated equipment. Standard glove box included.
Dedicated sputtering equipment for research on thin-film solid-state secondary batteries. Post-processing is possible. It allows for the simultaneous formation of the anode, electrolyte, and cathode using a multi-component cathode, as well as sealing the substrate to prevent exposure to the atmosphere after film formation. Pre-film tests using a dedicated Li target are also available (for a fee). Comprehensive support for materials (targets), soft (film formation tests), and hard (dedicated equipment). Sulfide targets and dedicated glove boxes can also be equipped, achieving both versatility and individual customization.
- Company：神港精機 東京支店
- Price：Other
300mm substrate compatible load-lock sputtering system
This is a device that supports the automatic transport of large substrates and can be applied from research and development to mass production. We will design it to meet your company's requirements.
This is a load-lock type sputtering device designed for the automatic transport of large substrates. 【Main Features】 - Capable of bare transport of large-diameter substrates, such as Φ300mm (support for square substrates is also possible). - Ensures a wide range of film thickness distribution with a uniquely designed cathode mechanism using standard target sizes. - Chamber structure that allows for easy target replacement and inspection/repair of the deposition chamber. - Future expansion of the process chamber is also possible. - Optionally equipped with a unique dense film formation unit (patented technology). We can also provide a video introduction of the device. Please feel free to contact us.
- Company：神港精機 東京支店
- Price：Other
Uniform Plasma Sputtering Device
High-quality sputtering through uniform plasma confinement
The "Uniform Plasma Sputtering Device" adopts the so-called opposing target sputtering method. The conventional opposing target sputtering method utilizes the mirror magnetic field as it is, but it has been improved with the aim of sputtering while taking advantage of the characteristics of the mirror magnetic field. Utilizing the plasma confinement method with a mirror magnetic field for sputtering is very effective, as it does not require significant changes in its form for sputtering use; by placing two targets opposite each other, plasma can be efficiently confined between them. In contrast, plasma confinement methods using toroidal coils, such as the tokamak type, face difficulties when applied to sputtering, and currently, a form resembling a cross-section of a toroidal coil is typically used. In this case, drift occurs, and the plasma cannot be sufficiently confined, causing it to spread within the container. However, merely having a mirror magnetic field is advantageous for plasma confinement between targets when used for sputtering, but uniformity cannot be expected. Therefore, the Uniform Plasma Sputtering Device achieves both plasma confinement and uniformity.
- Company：ヤシマ
- Price：Other
Research and development equipment / ultra-high vacuum equipment
Build a reliable system! Leave maintenance and modifications to us.
Our company has been involved in vacuum technology for over 30 years, providing products tailored to user specifications primarily to research institutions. We offer a wide range of vacuum deposition equipment, including the "RF Magnetron Sputtering System," which allows for dual gas introduction, and the "Compact Vacuum Evaporation System," which enables affordable and easy thin film production. Additionally, we have various research equipment available, such as "Vacuum Chambers" and "Turbo Vacuum Pumps." Please feel free to consult us when needed. 【Features】 <Vacuum Deposition Equipment> ■ Designed with consideration for the expandability of the system ■ Engineered to be an economical system ■ Supports target sizes from simple, compact models to those exceeding 1 meter ■ Proven track record across a wide range of fields from experimentation to production *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ヤシマ
- Price：Other
Sputtering device
Combination of CVD chamber, deposition chamber, plasma cleaning chamber, etc. is also available! Many custom manufacturing achievements!
We would like to introduce the "sputtering equipment" handled by Japan Create. We offer a range of products including the "load-lock type sputtering equipment" equipped with our unique sputter cathode, as well as "multi-target sputtering equipment" and "sputtering equipment for three-dimensional objects." We also have a track record of custom-made equipment such as ultra-high temperature sputtering systems for thin-film MEMS, IBS systems for research and development, and sputtering equipment with GB for organic EL. Please feel free to contact us when you need assistance. 【Features of Load-Lock Type Sputtering Equipment】 ■ Compatible with moving magnets, allowing for full-area erosion ■ Equipped with our unique rapid heating mechanism for substrates, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputter deposition ■ Capable of low-temperature processes such as lift-off ■ Tray transport is also supported *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
Custom Manufacturing Achievements: Sputtering Equipment
We have achievements such as 'sputtering equipment with GB for organic EL' and 'IBS equipment for research and development'!
We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "sputtering equipment." We have a track record that includes "ultra-high temperature sputtering equipment for thin film MEMS," "sputtering equipment with GB for organic EL," and "IBS equipment for research and development." We are conducting sample processing with a demo machine. Please feel free to contact us when needed. 【Manufacturing Achievements (Excerpt)】 ■ Ultra-high temperature sputtering equipment for thin film MEMS ■ Batch-type sputtering equipment for thin film MEMS ■ Multi-component composite sputtering equipment ■ Sputtering equipment with GB for organic EL ■ Load-lock type binary sputtering equipment *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
Load-lock type sputtering device
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
The "Load Lock Type Sputtering Device" is compatible with moving magnets and allows for full-area erosion. Equipped with our unique sputter cathode and rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. With plasma analysis and feedback control through a light emission analysis system, it enables high-speed and stable reactive sputtering film formation. 【Features】 ■ Equipped with our unique sputter cathode ■ Compatible with moving magnets and allows for full-area erosion ■ Equipped with our unique rapid temperature rise and fall substrate heating mechanism, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputtering film formation ■ Also supports low-temperature processes such as lift-off *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
Multi-target sputtering device
Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.
The "Multi-Target Sputtering System" is equipped with up to four sputter cathodes, enabling the deposition of layered films such as metal films and oxide films. It is also compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. Additionally, it features a three-axis mechanism (elevation, revolution, rotation) on the substrate stage to achieve a uniform film thickness distribution. 【Features】 ■ Equipped with our proprietary sputter cathodes ■ Incorporates our unique rapid elevation and heating mechanism for substrates, achieving substrate temperatures of 900°C ■ Capable of mounting up to four sputter cathodes for the deposition of layered films such as metal films and oxide films ■ Supports tray transport ■ Compatible with combinations of CVD chambers, evaporation chambers, plasma cleaning chambers, etc. *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
Sputtering device for three-dimensional objects
Achieve high coverage in three-dimensional object film formation! Equipped with up to three sputter cathodes, it enables the layered deposition of metal films, oxide films, and more!
The "Sputtering Device for Three-Dimensional Objects" is equipped with our proprietary sputter cathode. It features a 4-axis mechanism (elevation, revolution, rotation, tilt) on the work stage, achieving high coverage in the deposition of three-dimensional objects. It also includes a heating mechanism and bias power supply, enabling reverse sputtering, high-temperature sputtering, and film stress control. It can accommodate up to three sputter cathodes, allowing for the layered deposition of metal films, oxide films, and more. 【Features】 - Equipped with our proprietary sputter cathode - 4-axis mechanism on the work stage achieves high coverage in the deposition of three-dimensional objects - Can accommodate up to three sputter cathodes for layered deposition of metal films, oxide films, etc. - Custom orders can also be manufactured - Sample processing is conducted using a demonstration machine *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
High-Rate Deposition. Piezoelectric Film Formation Sputtering Device
For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!
The "Piezoelectric Film Formation Sputtering Device" is a product capable of detecting elements that contribute to the reduction of piezoelectric properties, thanks to the incorporation of a plasma emission monitor. It allows for continuous film formation from a single crystal epitaxial buffer layer to the piezoelectric film. Additionally, high-speed and stable reactive sputter deposition is possible through plasma analysis and feedback control using a luminescence analysis system. Equipped with our unique rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. 【Features】 ■ Deposition structure that maximizes the axis length contributing to piezoelectricity ■ Equipped with our proprietary sputter cathode ■ Compatible with moving magnets, allowing for full-area erosion ■ Tray transport compatibility ■ Combinations with CVD chambers, deposition chambers, plasma cleaning chambers, etc., are also supported *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
Screw stirring type powder sputtering device
Space-saving and large capacity! Custom-made options are also available to meet various requests!
This product is a device that applies our specialized sputtering technology to form films on various three-dimensional shapes made of metal, ceramics, and resin. It can be used for applications such as cosmetics, electronic components, battery parts, and the development of high-performance materials. In addition, we can propose various devices for miniaturization/large-scale production, CVD/various plasma treatments, and barrel/drum types. 【Features】 ■ Space-saving ■ Large capacity ■ Equipped with a unique sputter cathode ■ Screw-type stirring mechanism *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
Barrel/drum-type powder sputtering device
Powder agglomeration measures are possible! Custom-made solutions tailored to various requests can also be produced!
This product is a device that applies our specialized sputtering technology to form films on various three-dimensional shapes made of metal, ceramics, and resin. It can be used for applications such as cosmetics, electronic components, battery parts, and the development of high-functionality materials. In addition, we can propose various devices for miniaturization/large-scale production, CVD/various plasma treatments, barrel/drum types, and more. 【Features】 ■ Space-saving ■ Large capacity ■ Equipped with a unique sputter cathode ■ Stirring mechanism *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
RF sputtering device "SP-3400"
Inverted sputtering is also possible! Equipped with a 500W high-frequency power supply, it can deposit metals, oxides, insulators, and more.
The "SP-3400" is an RF sputtering device equipped with three sources for 3-inch cathodes. It features a single 500W high-frequency power supply, enabling the deposition of metals, oxides, insulators, and more. By incorporating two automatic matching units, it allows for reverse sputtering through switching, and it also comes standard with a substrate rotation mechanism to improve the film thickness distribution during deposition. The device uses an operational touch screen, making it easy for beginners to perform automatic operation of the exhaust system, and it is equipped with safety circuits to prevent malfunctions. 【Features】 ■ Three sources for 3-inch cathodes ■ One 500W high-frequency power supply ■ Capable of depositing metals, oxides, insulators, etc. ■ Reverse sputtering is possible by switching with two automatic matching units ■ Standard substrate rotation mechanism to improve film thickness distribution during deposition ■ Operational touch screen for easy automatic operation of the exhaust system, even for beginners *For more details, please refer to the PDF document or feel free to contact us.
- Company：サンバック 本社
- Price：Other
RF sputtering device for research and development experiments
Customization according to experimental purposes is possible. Small RF sputtering device.
☆Metal thin films, of course, as well as small RF sputtering devices for the production of insulating films/oxide films☆ Recommended POINT <Customization according to experimental purposes!!> 1. Three types of chambers available to match sample sizes 2. Cathode sizes compatible from 2 to 6 inches 3. The 2-inch cathode type also supports a three-source configuration = Achieving thin film stacking 4. A variety of options available Substrate heating unit / Substrate cooling unit / MFC unit, etc.
- Company：サンユー電子
- Price：Other
RF sputtering device for research and development experiments
Customizable to fit experimental purposes. Small RF sputtering device.
A compact RF sputtering device compatible with the production of metal films, as well as insulating films/oxide films. 【Features】 ○ Three types of chambers available to match sample sizes 〇 Cathode sizes compatible with 2, 4, and 6 inches 〇 The 2-inch cathode type also supports a three-source configuration ⇒ Enables the production of stacked films 〇 A variety of options available Substrate heating unit / Substrate cooling unit / MFC unit, etc.
- Company：サンユー電子
- Price：Other
Research and development sputtering equipment
This is a research and development sputtering device suitable for various film deposition applications, featuring high-level specifications and a wide range of options.
Features ■ Adopts a clean side sputtering method ■ Available in two models: load-lock type and batch type ■ Easy operation and film formation condition management via a touch panel, with a device concept that facilitates maintenance ■ Compact design that does not require much installation space ■ A wide range of options to meet customer requests and applications ■ Supports low-temperature and high-temperature sputtering ■ Standard equipped with a sputtering source that provides good distribution over a wide area (within ±5% (for SiO2 within φ170mm)) ■ Automatic transport options available for small-scale production and nighttime automatic operation ■ Applications - Organic EL, solar cells, optical components, bio, semiconductor and electronic components, automotive and resin, special films, MEMS ■ Typical film formation materials - Dielectric films and others SiN, SiO2, ZrO, TiO2, polymer films - Transparent conductive films ITO, ZnO - Metal films and others Au, Ag, Cu, Si, Ti, Sn, Cr, Al, Ni, DLC, electromagnetic wave shielding
- Company：芝浦メカトロニクス
- Price：Other
Sputtering device
Sputtering device
This is a film deposition device that utilizes the phenomenon of sputtering, where atoms or molecules that have been ionized and accelerated collide with a solid surface, causing solid material to be ejected from the surface. It has high industrial value because it can be applied to high melting point metals, alloy materials, dielectrics, and insulating materials.
- Company：北野精機
- Price：Other
Pressure Gradient Type Sputtering Device "PGS model"
We will introduce a device capable of forming low-damage, high-quality thin films through a high route.
The "PGS Model" is a revolutionary sputtering device that employs the pressure gradient phenomenon. It enables sputter deposition in a high vacuum environment. Additionally, it can form low-damage, high-quality thin films through a high route. This product is the result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science. 【Features】 ■ Utilizes the pressure gradient phenomenon ■ Enables sputter deposition in a high vacuum environment ■ Result of collaborative research with Kyushu University, Meijo University, and Okayama University of Science *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ケニックス
- Price：Other
Multi-source RF sputtering device with glove box
A research membrane environment that aims to eliminate oxygen and moisture! Supports multilayer membranes, compound membranes, and reactive membranes!
This product is a sputtering device for the development of batteries, catalyst materials, and organic devices. It connects a load lock chamber and a glove box to the sputtering chamber. It can accommodate four UHV-compatible sputter cathodes. Additionally, it supports multilayer films, compound film deposition, and reactive film deposition. 【Features】 ■ For the development of batteries, catalyst materials, and organic devices ■ Connects a load lock chamber and a glove box to the sputtering chamber ■ Can accommodate four UHV-compatible sputter cathodes ■ Research film deposition environment that eliminates oxygen and moisture ■ Supports multilayer films, compound film deposition, and reactive film deposition *For more details, please refer to the PDF document or feel free to contact us.
- Company：ケニックス
- Price：Other
Small-scale research ion beam sputtering device
Experimental device equipped with an ion source, applicable for ultra-thin film multilayer deposition in precision optics.
The "Ion Beam Sputtering Device" from OSI is an experimental device equipped with an ion source that can be customized to meet the usage needs of customers. It demonstrates capabilities equivalent to Veeco's SPECTOR. It uses RF ion sources for sputtering and for assist applications, making it suitable for the deposition of ultra-thin multilayer films in precision optics, equipped with OMS or OTM software. 【Features】 ■ Experimental device equipped with an ion source ■ Equipped with capabilities equivalent to Veeco's SPECTOR ■ Ideal for ultra-thin multilayer film deposition in precision optics with OMS or OTM software ■ Customizable to meet usage needs For more details, please contact us or download the catalog.
- Company：アールエムテック
- Price：Other
Sputtering device
Sputtering device
We offer the "Mirrortron sputtering device," which features unique technology developed by Choshu Industries and employs a counter-target method. It achieves low plasma damage and low substrate temperatures while allowing for the desired functional films to be obtained. In the organic EL field, it is ideal for forming transparent conductive films and sealing films in top-emission structures. We provide optimal processes across various fields, including organic devices such as organic solar cells and organic semiconductors, electronic components, and resin films. Additionally, we also offer sputtering devices using parallel plate and cylindrical methods.
- Company：長州産業
- Price：Other
