Device manufacturing examples
Leave the design and manufacturing of vacuum devices to us!
Here is an introduction to a case study of equipment manufacturing that our company has undertaken.
- Company：コスモ・サイエンス
- Price：Other
Sputtering Equipment Product List and Ranking from 43 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Sputtering Equipment Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
- テルモセラ・ジャパン 本社 Tokyo//Industrial Electrical Equipment
- 神港精機 東京支店 Tokyo//Industrial Machinery
- サンユー電子 Tokyo//Testing, Analysis and Measurement
- 4 Bühler K.K. Kanagawa//Food Machinery
- 5 ジャパンクリエイト Saitama//Testing, Analysis and Measurement
Sputtering Equipment Product ranking
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
- 【nanoPVD-S10A】Magnetron Sputtering Device テルモセラ・ジャパン 本社
- Desktop RF Sputtering Device 'SVC-700RFIII' サンユー電子
- HELIOS Sputtering Device for Optical Thin Films Bühler K.K.
- 4 Semi-automatic grinding device for steel samples SAB-2-200 ハルツォク・ジャパン
- 5 Supports multiple metals! It is an ultra-compact coater in the smallest class in the industry. サンユー電子
Sputtering Equipment Product List
1～15 item / All 134 items
Displayed results
Multi-purpose sputtering device
Support from research and development to mass production!
Supported by highly reliable standard hardware and a wealth of experience, Shinko Seiki has been active in many fields since launching its first machine in 1967. We provide state-of-the-art equipment that consistently leads the way with flexible and advanced software.
- Company：神港精機 東京支店
- Price：Other
Standard Batch Type Sputtering Device (SRV Series)
Multi-functional, compact, flexible support, a standard lineup with proven results and trust.
A standard batch-type sputtering series that incorporates a three-element cathode into a compact housing. It covers the film deposition process for various electronic devices and related materials from basic development to mass production, thanks to a wide uniform range of film thickness distribution and an automatic control mechanism. Our film deposition processes and options, supported by numerous delivery records, will reliably meet your requirements.
- Company：神港精機 東京支店
- Price：Other
Research and development sputtering equipment
Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.
Realization of the capabilities of a higher-end model capable of small-scale production using a manually operated simple experimental machine. An 8-inch compatible multi-frequency RF sputtering device. Supports fundamental research in MEMS, compound semiconductors, and electronic devices due to high-speed exhaust and excellent process performance. A series of batch-type sputtering devices with a proven track record in mass production of electronic components.
- Company：神港精機 東京支店
- Price：Other
SDR-type roll-to-roll sputtering device (RtoR type sputtering device)
Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.
Achieving mass production of flexible electronic devices represented by FPC with proven results. Reliable response to various individual requirements through process support using in-house demonstration equipment. Proven results with a wide range of substrates, including not only general resin films but also metal foils. Stable operation is realized through a high-utilization cathode developed in-house and a well-established transport mechanism. Equipped with a variety of optional mechanisms such as plasma pre-treatment electrodes, cathodes for magnetic materials, and main rolls for substrate heating, it can be operated as a multipurpose continuous film processing device. Flexible realization of hardware and software according to purpose and application, including small machines for R&D and batch-type equipment compatible with sheets.
- Company：神港精機 東京支店
- Price：Other
Mass production compatible batch-type sputtering system (Model STH10311)
A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.
This is a batch-type sputtering device that achieves both processing capacity for mass production and excellent film thickness uniformity by adopting multiple self-rotation substrate stages. Despite being a chamber system exceeding 1 meter due to the side sputtering method, it enables easy attachment and detachment of substrates and targets, as well as simplified maintenance within the vacuum chamber. It incorporates essential considerations for mass production equipment, such as a data logging system optimal for mass production and control interface software that facilitates device control and management. It balances quality and throughput for large substrates represented by 300 mm wafers, as well as for the mass production of small electronic components like resistors and sensors.
- Company：神港精機 東京支店
- Price：Other
Demonstration of the load lock type sputtering device (single wafer transport type) is currently in progress.
From discrete components to advanced devices, from R&D to mass production. A compact, high-quality, multi-purpose CtoC type sputtering system.
A load-lock type sputtering device based on single-sheet substrate transport, sharing the process chamber and transport mechanism with a higher-end model (multi-chamber type). Capable of meeting high-level film quality requirements for mass production and prototyping of various ICs (discrete ICs, custom ICs, compounds). Proven track record in the development of next-generation devices (ferroelectric film development, oriented nitride film formation) in both software and hardware. Achievements include AlN films for UV-LED templates, oxide films for sensors, highly uniform electrode films, thin-film heaters, ferroelectric (PZT) films, and many others.
- Company：神港精機 東京支店
- Price：Other
Multi-chamber sputtering device
A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.
Actively responding to various applications and substrates that are difficult to accommodate with standard specifications. Dedicated mechanisms are prepared for many substrates, including R&D, discrete components, compounds, MEMS, packaging, assembly processes, masks, and small FPDs. Tray transport of substrates is also standard, enabling film deposition and processing of different types of substrates on the same device through atmospheric substrate handling. In addition to application-specific cathodes (wide erosion, ferromagnetic materials, oxides, reactive types), we support a wide range of applications with special substrate mechanisms (high-temperature heating, magnetic field application, cooling, etc.). Dedicated devices are individually designed based on process tests using in-house demonstration machines.
- Company：神港精機 東京支店
- Price：Other
Hard film sputtering device STL5521 type (for precision lens molds)
Multi-layer film deposition using a maximum of 5 yuan cathodes. Wear resistance, heat resistance, and smooth thin films. High throughput even for high-temperature deposition with a load lock type.
Ideal for forming high heat-resistant wear-resistant films necessary for the coating of precision lens molds. Precious metal alloys such as Pt and Ru suitable for lens mold coatings are efficiently formed using a multi-target simultaneous sputtering method with a small-diameter cathode. Additionally, films with excellent heat resistance and hardness can also be formed using a nano-multilayer structure. A special substrate holder that can rapidly heat substrates like precision lens molds, along with a dedicated load-lock mechanism, achieves improved throughput.
- Company：神港精機 東京支店
- Price：Other
Atmospheric non-exposure multi-sputtering device
Sulfur compound compatibility available. Dedicated film deposition device for research on thin-film solid-state batteries. Comprehensive support from target to film deposition testing, including dedicated equipment. Standard glove box included.
Dedicated sputtering equipment for research on thin-film solid-state secondary batteries. Post-processing is possible. It allows for the simultaneous formation of the anode, electrolyte, and cathode using a multi-component cathode, as well as sealing the substrate to prevent exposure to the atmosphere after film formation. Pre-film tests using a dedicated Li target are also available (for a fee). Comprehensive support for materials (targets), soft (film formation tests), and hard (dedicated equipment). Sulfide targets and dedicated glove boxes can also be equipped, achieving both versatility and individual customization.
- Company：神港精機 東京支店
- Price：Other
300mm substrate compatible load-lock sputtering system
This is a device that supports the automatic transport of large substrates and can be applied from research and development to mass production. We will design it to meet your company's requirements.
This is a load-lock type sputtering device designed for the automatic transport of large substrates. 【Main Features】 - Capable of bare transport of large-diameter substrates, such as Φ300mm (support for square substrates is also possible). - Ensures a wide range of film thickness distribution with a uniquely designed cathode mechanism using standard target sizes. - Chamber structure that allows for easy target replacement and inspection/repair of the deposition chamber. - Future expansion of the process chamber is also possible. - Optionally equipped with a unique dense film formation unit (patented technology). We can also provide a video introduction of the device. Please feel free to contact us.
- Company：神港精機 東京支店
- Price：Other
Uniform Plasma Sputtering Device
High-quality sputtering through uniform plasma confinement
The "Uniform Plasma Sputtering Device" adopts the so-called opposing target sputtering method. The conventional opposing target sputtering method utilizes the mirror magnetic field as it is, but it has been improved with the aim of sputtering while taking advantage of the characteristics of the mirror magnetic field. Utilizing the plasma confinement method with a mirror magnetic field for sputtering is very effective, as it does not require significant changes in its form for sputtering use; by placing two targets opposite each other, plasma can be efficiently confined between them. In contrast, plasma confinement methods using toroidal coils, such as the tokamak type, face difficulties when applied to sputtering, and currently, a form resembling a cross-section of a toroidal coil is typically used. In this case, drift occurs, and the plasma cannot be sufficiently confined, causing it to spread within the container. However, merely having a mirror magnetic field is advantageous for plasma confinement between targets when used for sputtering, but uniformity cannot be expected. Therefore, the Uniform Plasma Sputtering Device achieves both plasma confinement and uniformity.
- Company：ヤシマ
- Price：Other
Research and development equipment / ultra-high vacuum equipment
Build a reliable system! Leave maintenance and modifications to us.
Our company has been involved in vacuum technology for over 30 years, providing products tailored to user specifications primarily to research institutions. We offer a wide range of vacuum deposition equipment, including the "RF Magnetron Sputtering System," which allows for dual gas introduction, and the "Compact Vacuum Evaporation System," which enables affordable and easy thin film production. Additionally, we have various research equipment available, such as "Vacuum Chambers" and "Turbo Vacuum Pumps." Please feel free to consult us when needed. 【Features】 <Vacuum Deposition Equipment> ■ Designed with consideration for the expandability of the system ■ Engineered to be an economical system ■ Supports target sizes from simple, compact models to those exceeding 1 meter ■ Proven track record across a wide range of fields from experimentation to production *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ヤシマ
- Price：Other
Custom Manufacturing Achievements: Sputtering Equipment
We have achievements such as 'sputtering equipment with GB for organic EL' and 'IBS equipment for research and development'!
We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "sputtering equipment." We have a track record that includes "ultra-high temperature sputtering equipment for thin film MEMS," "sputtering equipment with GB for organic EL," and "IBS equipment for research and development." We are conducting sample processing with a demo machine. Please feel free to contact us when needed. 【Manufacturing Achievements (Excerpt)】 ■ Ultra-high temperature sputtering equipment for thin film MEMS ■ Batch-type sputtering equipment for thin film MEMS ■ Multi-component composite sputtering equipment ■ Sputtering equipment with GB for organic EL ■ Load-lock type binary sputtering equipment *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
Load-lock type sputtering device
We can also accommodate combinations of CVD chambers, deposition chambers, plasma cleaning chambers, etc.!
The "Load Lock Type Sputtering Device" is compatible with moving magnets and allows for full-area erosion. Equipped with our unique sputter cathode and rapid temperature rise and fall substrate heating mechanism, it achieves a substrate temperature of 900°C. With plasma analysis and feedback control through a light emission analysis system, it enables high-speed and stable reactive sputtering film formation. 【Features】 ■ Equipped with our unique sputter cathode ■ Compatible with moving magnets and allows for full-area erosion ■ Equipped with our unique rapid temperature rise and fall substrate heating mechanism, achieving a substrate temperature of 900°C ■ Enables high-speed and stable reactive sputtering film formation ■ Also supports low-temperature processes such as lift-off *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジャパンクリエイト
- Price：Other
